TSMC accelerates 3nm mass production, and AMD becomes the largest HPC customer

AMD, a major processor manufacturer, and TSMC, a wafer foundry, will accelerate the development and mass production of advanced processes for chiplets-based processors in the second half of the year. It is understood that Supermicro has already ordered TSMC for 5nm and 3nm production capacity for the next two years. It is expected to launch 5nm Zen 4 architecture processors in 2022, and 3nm Zen 5 architecture processors will be launched between 2023 and 2024. The largest customer of TSMC’s 5nm and 3nm high performance computing (HPC).

In the first half of the year, Super Micro completed the product line conversion of Zen 3 architecture processors and RDNA 2 architecture graphics chips, and has become one of TSMC’s top three 7nm customers. Supermicro CEO Su Zifeng will deliver a keynote speech at Computex 2021 on June 1, and share Supermicro’s vision for the future of computing with the title “AMD Accelerates Development of High-Performance Computing Industry Systems” ‘s vision to articulate the continued expansion of adoption of Supermicro HPC computing and graphics solutions.

When Su Zifeng attended the JPMorgan Chase conference a few days ago, he confirmed that the first Zen 4 architecture server processor Genoa will be launched next year. According to industry sources, in the second half of the year, Super Micro will fully sprint the Zen 4 architecture processor to complete the design finalization. Among them, Genoa adopts the chiplet architecture design and TSMC 5nm process, a single processor can reach up to 96 cores and 192 threads, and supports simultaneous support 12-channel DDR5 and 128-channel PCIe 5.0 high-speed transmission.

Supermicro Zen 4 architecture Ryzen 7000 series desktop central processor Raphael and accelerator processor Phoenix also use TSMC’s 5nm process, and the I/O chip used is TSMC 6nm. Supermicro will support the next-generation AM5 slot and DDR5 memory in the Zen 4 architecture, but only support PCIe 4.0 for high-speed transmission. The industry expects Su Zifeng to release more information on Zen 4 architecture processors in his keynote speech at the Computer Show.

As TSMC’s 3nm process enters mass production in the second half of next year, and the production capacity will be released significantly in 2023, the industry has recently released news about the AMD 3nm process product line. It is expected that AMD will adopt TSMC in 2023-2024. The Zen 5 architecture processor was launched in the 3nm process, including the server processor codenamed Turin, the Ryzen 8000 series desktop central processor Granite Ridge and the acceleration processor Strix Point.

Since the shortage of foundry capacity may continue until 2023, Apple has placed an order with TSMC to ensure the smooth mass production of iPhone application processors and Apple Silicon computer processors, including Intel, Qualcomm, Huida, MediaTek, etc. are also actively striving for 7nm and 5nm capacity. After Supermicro confirmed the technical blueprint for future products, it was rumored in the industry that it had ordered TSMC for 5nm and 3nm production capacity in the next two years, and Supermicro will therefore become the largest customer in the HPC field of TSMC.

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