According to Beijing Yizhuang, the first phase of SMIC Capital’s 12-inch IC wafer and IC packaging project (hereinafter referred to as “SMIC Capital Phase I Project”) is under construction.
According to Yan Chao, the project manager of the SMIC Phase I Project Manager Department, the project is currently under construction of foundation piles, with a total of 4,887 piles. 3,200 piles have been completed and are expected to be completed by the end of February.
△ Source: Beijing Yizhuang
The report pointed out that the construction scale of the first phase of the SMIC Beijing City project is about 240,000 square meters, including FAB3P1 production plants and supporting buildings and structures. The total investment of the project is about 49.7 billion yuan and will be constructed in two phases. The first phase of the project is scheduled to be completed in 2024. After completion, it will achieve a monthly production capacity of about 100,000 12-inch wafers.
On December 7, 2020, SMIC Beijing Integrated Circuit Manufacturing (Beijing) Co., Ltd. was formally established with a total investment of 7.6 billion U.S. dollars and a registered capital of 5 billion U.S. dollars. The wholly-owned subsidiary SMIC Holdings (holding 51% of the shares), the second phase of the Big Fund (24.49% of the shares) and Yizhuang State Investment (24.51% of the shares) jointly invested.
△ Source: Sky Eye Check
On February 3, 2021, the Beijing Economic and Technological Development Zone signed 129 “two-zone” construction projects, and the SMIC Capital Project with a single investment of US$7.6 billion was officially launched.
For a long time, Beijing Economic and Technological Development Zone has been focusing on the development of the integrated circuit industry. As a region with a relatively high concentration of integrated circuit industry and advanced technology in the country, it has now formed a leading position with SMIC and Northern Huachuang, including design, wafer A complete integrated circuit industry chain including manufacturing, packaging and testing, equipment, parts, and materials has built an integrated circuit ecosystem of “chip-software-machine-system-information services”. There are about 100 related companies and the industrial scale accounts for Beijing 1/2 of the city.